Advanced Thermal Measurement
Techniques
1. Name of the event: Advanced Thermal
Measurement Techniques
2. Type of the event: intensive course
3. Number of hours or days: 2 days
4. Planned dates: June 20-21, 2005
5. Frequency: one-time event
6. Venue: Technical University of Lodz,
Lodz,
Poland
7. Target audience: university teaching
staff, PhD. students, university students, engineers from the
industry
8. Prerequisites (expected knowledge and experience of participants): basic knowledge on heat transfer
9. Character of the event: International,
open
10. Expected fee: Free of charge for REASON
partners, for others 10 EURO
11. Are travel grants available ? No
12. Language of the event: English
13. Number of participants: maximum 8. Priority
for REASON partners.
14. Brief description of the programme of the event:
Modern techniques allow to perform fast, accurate and non-invasive
thermal measurements. In particular, measurements performed using
thermographic cameras can be extremely useful, as they at once give
information about temperature distribution in a large area. However,
performing correct measurements is not an easy task, there mare many
factors that influence the process and can spoil measurement results.
The course will show both the advantages coming from the application of
modern thermal measurement techniques and the ways to guard against
measurement errors.
The course will consist of 8 hours of lectures explaining the
participants the theory and techniques of thermal measurements and 8
hours of laboratory giving the opportunity to apply the acquired
knowledge in practice.
Notice: Please note that the number of participants is limited to 8.
The REASON participants will have the priority if the number of
requests exceeds the maximum number of course participants.
Contents:
Day 1. (June 20th)
Thermal measurements – theory and modern techniques.
9.00 – 13.00 Lectures I.
1. Current thermal measurement techniques –
advantages, disadvantages and suitability for different applications.
2. Thermographic measurements:
2.1. Principles of thermographic measurements:
2.1.1. Basics of heat transfer.
2.1.2. Infrared measurements in theory.
2.1.3. Types and construction of radiation sensors
and thermographic cameras.
2.1.4. Typical fields of application.
3. Performing correct thermographic measurements:
3.1. Preparation of the object of examination.
3.2. Preventing measurement errors.
13.00 – 14.30 Lunch break.
14.30 – 18.30 Lectures II.
4. Postprocessing of the thermograms:
4.1. Emissivity correction.
4.2. Extracting information.
5. P-N junction as a temperature sensor:
5.1. Principles.
5.2. Fields of application.
Day 2. (June 21st)
Thermal measurements – practical exercises.
9.00 – 13.00 Laboratory I.
1. Thermographic measurements:
1.1. Introduction to the Inframetrics SC1000
thermographic camera and additional equipment.
1.2. Illustration of possible measurement errors:
1.2.1. Influence of emissivity factor.
1.2.2. Problems with reflections.
1.2.3. Effects of limited spatial resolution.
1.2.4. Results of measurement noise.
2. Calculation of an RC thermal model parameters.
13.00 – 14.30 Lunch break.
14.30 – 18.30 Laboratory II.
3. P-N junction measurements:
3.1. Measurements of a sample integrated circuit.
3.2. Comparison with thermographic measurements
results.
3.3. Calculation of thermal resistance.
4. Using the postprocessing programs.
Download general information and course
program as PDF file
Accommodation: Katarzyna Bieniek
General information: Wojciech
Tylman
Last updated: April 14, 2005